The postdoctoral researcher will focus on scaling interconnects for microcomponent assembly, tackling challenges related to metallurgy, fabrication reproducibility, and property modeling. The role involves designing, fabricating, and characterizing novel interconnects to advance chip assembly technologies. The successful candidate will collaborate with a multidisciplinary team, contributing to innovative research at TU Delft's state-of-the-art facilities in the Electronic Components, Technology, and Materials (ECTM) section, working on next-generation chip production technologies aimed at improving throughput and sustainability.
